Sensor-based Registration and Stacking of Electronic Substrate Layers
Magazine Article, IEEE Robotics & Automation Magazine, Vol. 2, No. 4, pp. 30 - 35, December, 1995
Abstract
This sensor-based approach for registration and stacking of electronic substrate sublaminates replaces pin-in-slot methods, yet does not require accurate automation equipment. Tests of a pilot workcell for this approach showed that the contact holes were consistently aligned to 2.5 μm (3/spl sigma/), more than ten times better than the traditional mechanical method.
BibTeX
@periodical{Brennemann-1995-14051,author = {A. E. Brennemann and R. Hammer and W. V. Jecusco II and Ralph Hollis},
title = {Sensor-based Registration and Stacking of Electronic Substrate Layers},
journal = {IEEE Robotics & Automation Magazine},
year = {1995},
month = {December},
pages = {30 - 35},
volume = {2},
}
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