H. Han, Lee Weiss, and M. L. Reed
IEEE Journal of Micromechanical Systems, Vol. 1, No. 1, pp. 37 - 43, March, 1992.
Not available for download due to copyright restrictions. Please contact the author(s) for a copy.
Copyright notice: This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. These works may not be reposted without the explicit permission of the copyright holder.
|We have developed arrays of micromechanical mating structures, fabricated with silicon micromachining techniques, which act as mechanical adhesives. The microstructures are fabricated on standard silicon wafers, with an areal density of approximately 200 000 per cm2. The microstructures on two identical surfaces will self-align and interlock with each other under application of adequate external pressure. A tensile strength per unit interlocked area of 1.1 MPa, or 160 psi, has been achieved. In this paper, we describe the design and fabrication of this micromechanical Velcro"; we also present results of our experimental tests, a theoretical estimate of the tensile strength, and design constraints.|
Number of pages: 7
|H. Han, Lee Weiss, and M. L. Reed, "Micromechanical Velcro," IEEE Journal of Micromechanical Systems, Vol. 1, No. 1, pp. 37 - 43, March, 1992.|
author = "H. Han and Lee Weiss and M. L. Reed",
title = "Micromechanical Velcro",
journal = "IEEE Journal of Micromechanical Systems",
pages = "37 - 43",
month = "March",
year = "1992",
volume = "1",
number = "1",
|The Robotics Institute is part of the School of Computer Science, Carnegie Mellon University.|
Contact Us | Update Instructions