Micromechanical Velcro

H. Han, Lee Weiss, and M. L. Reed
IEEE Journal of Micromechanical Systems, Vol. 1, No. 1, March, 1992, pp. 37 - 43.


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Abstract
We have developed arrays of micromechanical mating structures, fabricated with silicon micromachining techniques, which act as mechanical adhesives. The microstructures are fabricated on standard silicon wafers, with an areal density of approximately 200 000 per cm2. The microstructures on two identical surfaces will self-align and interlock with each other under application of adequate external pressure. A tensile strength per unit interlocked area of 1.1 MPa, or 160 psi, has been achieved. In this paper, we describe the design and fabrication of this micromechanical Velcro"; we also present results of our experimental tests, a theoretical estimate of the tensile strength, and design constraints.

Notes
Number of pages: 7

Text Reference
H. Han, Lee Weiss, and M. L. Reed, "Micromechanical Velcro," IEEE Journal of Micromechanical Systems, Vol. 1, No. 1, March, 1992, pp. 37 - 43.

BibTeX Reference
@article{Weiss_1992_492,
   author = "H. Han and Lee Weiss and M. L. Reed",
   title = "Micromechanical Velcro",
   journal = "IEEE Journal of Micromechanical Systems",
   pages = "37 - 43",
   month = "March",
   year = "1992",
   volume = "1",
   number = "1",
}