Design and modeling of a micromechanical surface bonding system

H. Han, Lee Weiss, and M.L. Reed
Proceedings of the 1991 International Conference on Solid-State Sensors and Actuators, June, 1991, pp. 974 - 977.


Download
  • Adobe portable document format (pdf) (249KB)
Copyright notice: This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. These works may not be reposted without the explicit permission of the copyright holder.

Abstract
Optimization of the design of a micromechanical surface fastening system is discussed based on a simple cantilevered beam model. Theoretical estimates indicate that the bonding strength of these microstructures can be as high as 11-17 MPa, or 1500-2000 psi. The equivalent surface energy corresponding to the stored strain energy during separation of two interlocked sample pairs is 14.6 mu J/cm/sup 2/. The authors also report preliminary experimental results; a bonding strength of 1.1 MPa or 160 psi per unit interlocked area has been achieved, which is in agreement with the theoretical approximation.

Notes
Associated Lab(s) / Group(s): Shape Deposition Lab

Text Reference
H. Han, Lee Weiss, and M.L. Reed, "Design and modeling of a micromechanical surface bonding system," Proceedings of the 1991 International Conference on Solid-State Sensors and Actuators, June, 1991, pp. 974 - 977.

BibTeX Reference
@inproceedings{Weiss_1991_3592,
   author = "H. Han and Lee Weiss and M.L. Reed",
   title = "Design and modeling of a micromechanical surface bonding system",
   booktitle = "Proceedings of the 1991 International Conference on Solid-State Sensors and Actuators",
   pages = "974 - 977",
   month = "June",
   year = "1991",
}