Carnegie Mellon Robotics Institute
H. Han, Lee Weiss, and M.L. Reed
Proceedings of the 1991 International Conference on Solid-State Sensors and Actuators, June, 1991, pp. 974 - 977.
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| Abstract |
| Optimization of the design of a micromechanical surface fastening system is discussed based on a simple cantilevered beam model. Theoretical estimates indicate that the bonding strength of these microstructures can be as high as 11-17 MPa, or 1500-2000 psi. The equivalent surface energy corresponding to the stored strain energy during separation of two interlocked sample pairs is 14.6 mu J/cm/sup 2/. The authors also report preliminary experimental results; a bonding strength of 1.1 MPa or 160 psi per unit interlocked area has been achieved, which is in agreement with the theoretical approximation. |
| Notes |
Associated Lab(s) / Group(s):
Shape Deposition Lab |
| Text Reference |
| H. Han, Lee Weiss, and M.L. Reed, "Design and modeling of a micromechanical surface bonding system," Proceedings of the 1991 International Conference on Solid-State Sensors and Actuators, June, 1991, pp. 974 - 977. |
| BibTeX Reference |
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@inproceedings{Weiss_1991_3592, author = "H. Han and Lee Weiss and M.L. Reed", title = "Design and modeling of a micromechanical surface bonding system", booktitle = "Proceedings of the 1991 International Conference on Solid-State Sensors and Actuators", pages = "974 - 977", month = "June", year = "1991", } |
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