Mating and piercing micromechanical structures for surface bonding applications

H. Han, Lee Weiss, and M.L. Reed
Proceedings of the 1991 Micro Electro Mechanical Systems (MEMS '91), An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots, March, 1991, pp. 253 - 258.


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Abstract
The authors have developed two types of micromechanical structures, using silicon micromachining techniques, which act as mechanical adhesives. Arrays of structures are fabricated on standard silicon wafers, with an areal density of approximately 200000 per cm/sup 2/, resulting in very strong bonds. Individual components are 4-18 mu m wide, and 4-15 mu m high above the substrate. Mating structures, which interlock with themselves, and piercing structures, which interlock with biological tissues, have been fabricated and tested. The mechanical behavior of this micromechanical velcro is in approximate agreement with the calculated strength.

Notes
Associated Lab(s) / Group(s): Shape Deposition Lab

Text Reference
H. Han, Lee Weiss, and M.L. Reed, "Mating and piercing micromechanical structures for surface bonding applications," Proceedings of the 1991 Micro Electro Mechanical Systems (MEMS '91), An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots, March, 1991, pp. 253 - 258.

BibTeX Reference
@inproceedings{Weiss_1991_3591,
   author = "H. Han and Lee Weiss and M.L. Reed",
   title = "Mating and piercing micromechanical structures for surface bonding applications",
   booktitle = "Proceedings of the 1991 Micro Electro Mechanical Systems (MEMS '91), An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots",
   pages = "253 - 258",
   month = "March",
   year = "1991",
}